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This is a liquid encapsulating compound, two-component. Curing takes place at room temperature. The material provides a thermal conductivity and low expansion. Ideal for encapsulating or filling gaps in heat-generating electronic components with metal enclosures or heat sinks. Has an excellent fluidity when dosing and encapsulating. After curing it does not detach due to the cyclic heating from the surface to which it adheres. The cured product is dry to the touch.
Specifications:
- Manufacturer: AG TERMOPASTY
- Type of chemical agent: Silicone encapsulating compound
- Colour: Transparent
- Application: Sealing and encapsulation of electronic circuits
- Shore hardness (A): 26 (elastic)
- Operating temperature: -50...200°C
- Density: 970mg/cm3 @ 25°C
- Mix ratio: 100:8
- Dielectric constant: 3
- Appearance: Liquid
- Available labels languages: BG, CZ, DE, EN, FI, FR, HU, PL, RO, RU, SK
- Surface resistance: <10 TOhm
- Signal word: Warning
- Dielectric strength: 10kV/mm
- Bonding time: 40min
- Weight: 108g
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